Solder paste column M705, flux, board washing h2o with absolute Alcoholic beverages; board washing water is used to clean up the solder residue immediately after repair; thermal gel (specification: Fujipoly SPG-30B) is utilized to smear the area in the chip following repair ；ball-planting metal mesh, solder absorption wire, solder https://travisiaodq.targetblogs.com/32009038/not-known-factual-statements-about-antminer-s19-hashrate